Presspack IGBT

A modern design employing state-of-the-art technologies designed primarily for grid applications - high current, high voltage, high reliability.

Product Features

  • Novel housing solution using a typical hermetically-sealed hockey puck ceramic housing with internal compliance mechanism ensures optimum contact pressure distribution across all chips with standard thyristor heatsink and clamp assemblies and prevents over pressurisation of chips.
  • Chip assemblies employ silver sintering technology for improved robustness and improved thermal characteristics.
  •  New chipset designed and manufactured by Dynex in the UK.
  • First product will be 4.5kV with 125mm contact diameter rated from 1100A (1:1 IGBT:FRD ratio) to 3000A (all-IGBT)