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Driven by the manufacturing of highly efficient power assemblies that deliver on performance and reliability for specific customer applications, Dynex offer a varied range of industry standard power assemblies.
In order to maximise the semiconductor performance in an assembly, the type of heatsink, transient conditions, overloads, ambient temperature, surface finish (e.g. black anodised) and the method of cooling (air, liquid or phase change) is considered.
Our engineers encompass a wealth of experience and design assemblies with a range of bipolar and IGBT power semiconductor devices to ensure standard power assemblies are optimised for customer applications.
Thyristor/diode available, extruded aluminium heat pipe heat sinks.
Thyristor/diodes IGCT available, gate drive and protection.
Pulsed power device based for single switch application, gate drive and protection.
Alloyed diodes based air-cooling structure, vibration resistance and high reliability.
Alloyed diodes based air-cooling structure, compact and lightweight, stable and reliable performance.
IGCT/FRD based water cooling compact structure, up to 14 MVA.
If you need to talk to us about any of our products or services, get in touch.
+44 (0)1522 502 901
Power Assembly Enquiry
Power Factor Correction
Pulsed Power Assemblies
Rail Refurbishment & Overhaul
In-House Manufacturing Support
Download our Power Assemblies Product & Capability Brochure | 2020