The article, 'Enhancing MMC VSC HVDC system performance with press-pack IGBT technology' by Dr Sajad Ansari was publushed in the Power Electronics International Magazine 2025 - Issue 7.
Here, Dr S. Ansari discusses the mechanical, electrical, and operational advantages of press-pack IGBTs (PPIs). He highlights how their integration into spring-loaded stacks, ease of maintenance, and superior thermal management and fault-tolerant behaviour contribute to enhanced system robustness, lower lifecycle costs, and improved overall efficiency.
MMC-based VSC-HVDC systems require various power semiconductor devices including IGBT and FRD modules to perform voltage switching. Bypass thyristors may also be used to reduce current stress on the modules during DC-side faults by providing a controlled bypass. These systems demand semiconductor devices that are not only high-performing, but also robust, maintainable, and space-efficient. In this context, the Press-Pack IGBT (PPI) has emerged as the preferred solution over conventional encapsulated IGBTs with bond wires, particularly in high-reliability, mission-critical HVDC applications.
You can read the article here on how PPI technology enhanced MMC VSC HVDC systems.....
Dynex supplies a comprehensive range of power semiconductor devices suited for HVDC systems, including thyristors, FRDs, bypass thyristors, IGCTs, encapsulated IGBT modules, and press-pack IGBT modules. In particular, Dynex is advancing press-pack IGBT technology to meet the extreme voltage, thermal, and reliability demands of HVDC applications, with a strong emphasis on supporting Modular Multilevel Converter (MMC) topologies.
To meet with one of our engineers or a regional sales manager about our Press Pack IGBT range, please Contact Us