Power Assembly Components
Dynex has a range of semiconductor device clamps and heatsink profiles for maintaining the thermal and electromechanical integrity of the components during operation. These can be used for Diodes, Thyristors, GTO and IGBT products.
A line of pre-loaded clamps is offered, up to 180kN for our 150mm disc devices. Bar clamps are suitable for single and double-sided cooling, with high insulation versions available for high voltage assemblies.
Dynex has access to a range of aluminium extrusions from independent manufacturers giving our design team the best options available. Water cooled heatsinks are available which are designed for use in high current, high power assemblies such as single, three or six phase bridges or AC Controllers.
Dynex can also provide a wide range of accessories such as gate firing boards, voltage divider networks, control signal optical combiner and splitter boards, ground level power supplies and high voltage isolated stack firing systems for multi-level stacks (typically 10 levels).