Dynex’s Principal IGBT Design Engineer, Luther Ngwendson will be presenting at the PCIM Digital Days conference on Tuesday 7th July at 14:55pm (GMT+2).
He will present his research on ‘Exploring the RBSOA Boundaries of a 6.5kV/1000A Trench Gate IGBT Module at Different Temperatures’.
The paper explores Dynex’s new 6.5kV/1000A Trench gate IGBT module’s RBSOA at extremely high voltages and various temperatures. His findings show that optimised design features in Dynex’s new low Vce(sat) module (DIM1000ASM65-US) enables robust RBSOA performance up to 5.4kV Line voltage, at high temperature. The device shows ~50% reduction in both SSCM (Switching Self-Clamping Mode) duration as well as Eoff (turn-off energy loss) at Vline=5.3kV than previous LOCOS generation of trench IGBT module.
The presentation will discuss how under fault conditions especially in HVDC and similar applications, Dynex’s 6.5kV/1000A IGBT module can withstand very high line voltages and turn-off safely with limited Eoff. Under such extreme conditions the device is usually operating outside their datasheet recommended RBSOA where turn-off can be limited by increased dynamic avalanche, which increases Eoff. Excessive Eoff impacts reliability by accelerating wear out and increases the likelihood for thermal runaway and device destruction.
To join Luther’s presentation and for an opportunity to discuss in detail the boundaries of Dynex’s 6.5kV/1000A Trench Gate IGBT modules during a virtual round table, sign up to attend the PCIM Digital Days conference.
Register to attend the PCIM Digital Days Event here.