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Latest Product and Company News from Dynex

Reliability Study of Phase Change Thermal Interface Materials

Long-term reliability tests focused on use of M1 IGBT modules

Reliability Study of Phase Change Thermal Interface Materials

Dr Anwesha Fernandes will be presenting her research at PCIM on phase change printable pastes that have undergone long-term reliability testing carried out to understand the performance of  phase change thermal interface materials (PCTIMs).

PCTIMs are being increasingly used as replacement for thermal grease to improve the efficiency of heat dissipation and long-term reliability. Though the PCTIM market is well-established, it is vital to ensure that the materials are compatible with the power modules in terms of processing, performance and reliability. In this research, the reliability of phase change printable pastes were compared within an  application using  IGBT modules. Long-term reliability tests were carried out to understand the performance of the PCTIMs by using  a module-heatsink configuration.

Thermal Interface Materials are used in electronic applications to improve the efficiency of heat transfer and reduce the operating temperature of a device. The long-term reliability tests in this research paper focused on use of M1 IGBT modules which has a 122mm x 62mm baseplate size .

For an opportunity to discuss in detail Dr Anwesha Fernandes research, 'Reliability Study of Phase Change Thermal Interface Materials', sign up to attend the PCIM conference or contact us to arrange a meeting with our team at powersolutions@dynexsemi.com