Dynex Semiconductor continues to demonstrate its strong commitment to innovation in power electronics through the latest research from our R&D team, which will be presented at the CIPS 2026 – International Conference on Integrated Power Electronics Systems in Dresden, Germany.
Two Dynex researchers will present technical papers addressing key challenges in power module reliability, packaging technology, and predictive health monitoring. These are reas that are critical for the next generation of high-power electronic systems used in renewable energy, transportation, and industrial applications.
Advancing Power Module Reliability Through Innovative Interconnection Technology
Maryam Mat will present research exploring new approaches to improving the reliability of power module packaging.
Her paper, “Low-CTE Die-Top Interconnection Material for Ten-Fold Power Cycling Lifetime in Power Module Packaging,” investigates alternatives to conventional aluminium wire bond interconnections. While wire bonding has long been a standard technology in power modules, it can be vulnerable to thermo-mechanical fatigue during repeated power cycling.
The research examines the use of clip-based die-top interconnections made from Copper (Cu) and Copper-Molybdenum-Copper (CMC) materials with a low coefficient of thermal expansion (CTE). These materials help reduce thermal stress and improve current distribution across the device.
Testing demonstrated significant improvements in reliability. The CMC clip approach achieved:
Up to 10.9× longer power cycling lifetime compared with wire bonding using SAC305 solder
Up to 15.4× improvement when combined with high-temperature Pb-free die-attach solder
One of the key challenges in power module packaging is that improving the reliability of die-top interconnections can increase stress in the die-attach layer beneath the device. Dynex researchers addressed this by combining CMC clip interconnections with high-temperature Pb-free solder at the die attach, enabling both failure mechanisms to be effectively managed.
Detailed failure analysis using scanning acoustic microscopy (SAM), scanning electron microscopy (SEM), and optical microscopy confirmed stable electrical performance with minimal degradation of VCE(on) throughout testing.
This work reflects more than four years of focused R&D effort and has led to a patent filing, demonstrating Dyne
Industry relevance/impact/performance: With an online failure precursor data acquisition system, the developed prognostic model can be used for prognostic and health management, smart scheduling of maintenance, optimal operational strategies, early failure warning, remaining useful lifetime (RUL) prediction, and status of IGBT health degradation. This is a step towards more resilient and reliable power electronic systems for green tech and beyond.