R&D Wafer Fab Process Engineers

Closing date: 06.01.20
R&D Centre: Semiconductors
Full Time

We are currently recruiting for two R&D Wafer Fab Process Engineers to work with our R&D Centre and IGBT Engineering departments. The roles will involve responsibility for areas including photolithography, etch, CMP, bonding processes. Developing and optimising recipes for process flows will be required as well as managing process changes and improving yield. Interacting with design engineers and different departments within the company will be key.

Job Description

Job title:                       R&D Wafer Fab Process Engineers

Department:                Research and Development Centre

Location:                     Lincoln

Hours of work:             37 hours a week

Contract:                     Permanent

Salary:                          Competitive

Other:                           Hours: 8.30am – 5.00pm Monday -Thursday and 8.30am -4.30pm on a Friday (one hour unpaid lunch).

 

Job Summary

Dynex

Dynex Semiconductor Ltd have been manufacturing semiconductor products for over 60 years; providing IGBT, Bipolar, Power Assembly and Electric Vehicle System products to customers across the world. It is an exciting time to be joining Dynex as we are in a significant period of growth which is planned to continue.  We are searching for two R&D Wafer Fab Process Engineers to work with our R&D Centre and IGBT Engineering departments.

The Role

The roles will involve responsibility for areas including photolithography, etch, CMP, bonding processes. Developing and optimising recipes for process flows will be required as well as managing process changes and improving yield. Interacting with design engineers and different departments within the company will be key.

About you

You will be expected to hit the ground knowledge so we are looking for candidates who have practical experience of the wafer fab process and knowledge of IGBT’s, MOSFETS and CMOS processes / devices.  You will be dealing with Design Engineers so process knowledge is a must, as is a strong understanding of device and applications.

 

Our Benefits

Dynex is a great place to work with lots of opportunities for professional and personal development. Our benefits include:

  • 24 days holiday + 8 bank holidays
  • Holiday allowance increase with length of service
  • Holiday purchase scheme – up to 5 additional days
  • BUPA Medical Insurance
  • Free on-site car parking
  • Subsidised canteen
  • Contributory Pension
  • Life assurance
  • Cycle to work scheme
  • Company sick pay
  • Professional Membership fees paid e.g. CIPD, IEEE
  • Family Friendly policies
  • An Independent 24 hour confidential counseling service

 

Key Responsibilities

  • Leading projects based on improvement and process development
  • Reporting against targets to identify issues and improvements
  • Responsibility for carrying out problem solving activities
  • Ensure that Departmental Procedures are conformed to
  • Responsibility for areas including photolithography, etch, CMP, bonding processes
  • Developing and optimising recipes for process flows
  • Managing process changes and improving yield.

 

Core Skills

  • A Bachelors Degree in Engineering or Physical Science or equivalent
  • Knowledge of IGBT, MOSFET, Bipolar, CMOS process and/or devices
  • Practical experience with at least one of the following areas; Diffusion, ion implant, plasma etch, photolithography and/or PVD
  • Excellent semiconductor manufacturing background
  • Strong semiconductor wafer fab process experience
  • A sound understanding of Semiconductor device physics
  • Process simulation skills
  • Knowledge of electrical characterization of semiconductor components
  • Effective communicator with specialist and non-specialist colleagues
  • Ability to work well independently and/or as part of a team

 

Company Values

  • Continuous Improvement
  • Engineering Excellence
  • Performance Driven
  • Accountability and responsibility
  • Integrity and honesty

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Please note that candidate details will be held by HR at Dynex ONLY and personal details will not be passed onto any third parties unless involved in the recruitment process i.e. Recruiting Managers. HR will store all details on file for 6 months at which point they will be securely destroyed. Please contact .(JavaScript must be enabled to view this email address) if you have any questions.