Jobs at Dynex

Dynex can offer you individual development and reward opportunities in a number of unique departments.

Current Vacancies

If you would like to help us power the future please find an appropriate career opening below:

IGBT Assembly Process Engineering Group Leader

We are currently looking to recruit an experienced IGBT Assembly Process Engineering Group Leader to work within our IGBT Assembly Engineering department. The main responsibilities of the IGBT Assembly Process Engineering Group Leader is to take a senior role within both the IGBT Assembly area and within the wider company ensuring that identified tasks are carried out in a professional well organised manner.

Closing date: 06.08.19
IGBT Assembly Engineering
Full Time

Buyer

We are currently looking to recruit a Buyer to work within our well established Procurement department. The Buyer will have ownership and responsibility for a range of materials and services to support the business activities. You will bring organisational skills to manage a wide range of existing suppliers. You will actively consolidate existing sources and challenge costs to deliver savings, whilst ensuring a competitive environment to reduce risk. You will engage with suppliers to manage the order book and expedite outstanding orders to ensure that the production teams needs are fulfilled and that KPI’s are met.

Closing date: 31.07.19
Procurement
Full Time

Senior Materials Engineer

We are currently looking to recruit a Senior Materials Engineer to work within our R&D Center; Semiconductors. The Senior Materials Engineer is responsible undertake project related activities within R&D focusing on IGBT Power-Module packing materials: research, experimentation, design, testing and documentation. The role is responsible for carrying out research to an internationally recognised standard and providing reports. The Senior Materials Engineer will possess an in-depth understanding of Polymers, Encapsulation, silicone gel, plastics, epoxy, solder materials and the ability to characterise and analyse materials.

Closing date: 31.07.19
R&D Centre: Semiconductors
Full Time

Reliability and Qualification Engineer

We are currently recruiting for a Reliability and Qualification Engineer to work within our R&D Centre: Semiconductors department. The Reliability and Qualification Engineer will work in a ‘hands on role’ as part of small engineering team supervising the suite of qualification testers for high power discrete semiconductors. Your duties will mainly be taking responsibility for the day to day running of qualification and reliability testing of products. This will require liaising closely with R&D and production in order to manage access to parts and test facilities.   

Closing date: 31.07.19
R&D Centre: Semiconductors
Full Time

Principal Reliability and Qualification Engineer

We are currently recruiting for a Principal Reliability and Qualification Engineer to work within our R&D Centre: Semiconductors department. The Principal Reliability and Qualification Engineer will manage a small engineering team that is responsible for the qualification of new IGBT parts and process within the company. The responsibilities will include managing the team, resources and liaising with production, facilities and QA to align with set targets. In addition the successful applicant will identify and develop methods and materials to assist in the improvement of IGBT module reliability.

Closing date: 31.07.19
R&D Centre: Semiconductors
Full Time

Senior Test and Reliability Engineer

We are currently recruiting for a Senior Test and Reliability Engineer to work within our R&D Centre. The role will work primarily on characterisation of high power IGBT devices from 650V to 6.5K. The Senior Test and Reliability Engineers work will involve submission of data sheets, application notes and supporting documentation for transfer to production.

Closing date: 31.07.19
R&D Centre: Semiconductors
Full Time

IGBT Chip Design Engineer

We are currently recruiting for an IGBT Chip Design Engineer to work within our R&D Centre. The main duties of the IGBT Chip Design Engineer will be to develop new IGBT devices using simulation software and to correlate device models with actual device performance. The role will also require occasional travel to China and so will need to be able to meet visa requirements. 

Closing date: 31.07.19
R&D Centre: Semiconductors
Full Time

Applications Engineer

We currently have an exciting opportunity for an Applications Engineer to join our Sales and Marketing department. The role will support internal and external sales functions to maximise profit. The Applications Engineer is responsible for the creation and design of the requirements in accordance with customer needs. Application simulation and provide technical papers for the parameters of the products.

Closing date: 31.07.19
Sales and Marketing
Full Time