Jobs at Dynex

Dynex can offer you individual development and reward opportunities in a number of unique departments.

Current Vacancies

If you would like to help us power the future please find an appropriate career opening below:

Technical Sales Manager

We are currently recruiting a Technical Sales Manager to work within our Sales & Marketing department. The main duties of the Technical Sales Manager will be to develop new business opportunities and customers for high power semiconductor devices, liaising with staff both in China and the UK to determine product availability and prices. You will provide technical engineering support to the customer as required to secure the business and deal with any after sales enquiries. You will be responsible for managing allocated customer accounts achievement of yearly sales targets for a defined product range or customer region as agreed with the Sales & Marketing Director.

Closing date: 13.10.19
Sales & Marketing
Full Time

Process Engineer: Power Module Packaging

We are currently looking to recruit a Process Engineer: Power Module Packaging to work within our R&D Centre. The role will involve working on and leading projects and work packages focusing on die attach materials, engineering plastics, high performance polymers, ceramic substrates, and conformal coatings.  In addition to this, methods for the interconnection and processing of materials in semiconductor packaging will be a key area of research, with an emphasis on safe, high reliability, cost efficient, high-yield technology. 

Closing date: 27.09.19
R&D Centre: Semiconductors
Full Time

Principal Reliability and Qualification Engineer

We are currently recruiting for a Principal Reliability and Qualification Engineer to work within our R&D Centre. The Principal Reliability and Qualification Engineer will be responsible for developing a methodology to empirically predict the reliability of Dynex products in service. An excellent understanding of the wear out mechanisms of discrete semiconductors is essential as is the ability to work across multiple domains including thermal, physical and electrical. In addition, the successful applicant will identify and develop methods and materials to assist in the improvement of IGBT module reliability.

Closing date: 27.09.19
R&D Centre: Semiconductors
Full Time

Module Design Engineer

We are currently looking to recruit two Module Design Engineers to work with in our expanding R&D Centre. The main duties of the Module Design Engineer will be to focus on structure design and simulation for Traction and Electrical Vehicle module products.

Closing date: 27.09.19
R&D Centre: Semiconductors
Full Time

IGBT Chip Design Engineer

We are currently recruiting for an IGBT Chip Design Engineer to work within our R&D Centre. The main duties of the IGBT Chip Design Engineer will be to develop new IGBT devices using simulation software and to correlate device models with actual device performance. The role will also require occasional travel to China and so will need to be able to meet visa requirements. 

Closing date: 27.09.19
R&D Centre: Semiconductors
Full Time