Foundry Services Unit

With a wealth of experience in the design and manufacture of IGBT die and Bipolar wafers, Dynex has the capability to provide world class components to Semiconductor module companies, with a speciality in IGBT die in the range of 1.2kV to 6.5kV.

Dynex offers to the market a broad range of established, proven, Trench Gate and DMOS die that form the basis of Dynex’s own high-quality IGBT modules. This Foundry service has been provided to the market for a long time and has recently been opened up to a wider audience.

In addition, with its in-house chip design team, Dynex can customise die to specific customer requirements.  This, coupled with full technical support, world-class design capability, and rapid response to customer needs, shows that Dynex is truly differentiated in the foundry services arena.

At the same time, Dynex has refined the wafer fabrication processes to achieve benchmark levels of quality, reliability and yields, offering the following benefits to the wider market:

Key Benefits:

  • Robust process
  • Decades of experience
  • Broad range of capabilities
  • In-house chip design team
  • Customisable to suit requirements
  • Refined wafer fabrication processes

We are pleased to be offering this technology and process robustness and the benefits it brings to the wider semiconductor market

For further information please contact the Foundry Services team at:

powersolutions@dynexsemi.com

Dynex Semiconductor Ltd, Doddington Road, Lincoln LN6 3LF, United Kingdom 

Tel: +44(0)1522 500500