Dynex has the capability to design, develop and manufacture custom IGBT modules. Applications for power electronics devices often involve harsh operating conditions or environments necessitating devices capable of meeting these requirements. Dynex utilises our vast experience in the manufacture of power semiconductors to design and produce high-reliability IGBT modules customised to meet the individual demands of end applications including those in the aerospace, automotive, medical, renewable energy and traction markets.
Dynex Custom IGBT capabilities
Dynex IGBT products can be in either standard industry format footprints or in end customer defined formats with bespoke connectivity and/or circuit topology and/or heatsinks-water cooled/air-cooled/phase change or double side. To ensure consistency of product performance and quality all manufacturing is carried out under strictly controlled clean room conditions.
DYNEX capabilities can encompass the following:
• Laser welded assemblies
• Ultrasonic Welding processes
• Copper Wire bonds
• Various die technologies (Trench gate, SiC..)
• Liquid cooled heatsinks
• Customised busbar arrangements
• Silver Sintering
• Customised packaging (case materials)
• Hermetically sealed packages
Using our experience in design of IGBT modules, Dynex has designed and manufactured modules that have helped our customers:
• Reduce system cost,
• Reduce total system size & weight
• Improve thermal characteristics
• Maximise system efficiency
• Operate in severe environments
Using our in-house design team, Dynex continues to develop own processes and designs to utilise the latest techniques to improve cooling, current output, lifetime and reliability. Through initial concept to full production, Dynex will support your requirements to provide enhanced, reliable device outlines to meet your stringent demands.