Current Vacancies

DYNEX SEMICONDUCTOR LTD

Dynex Semiconductor Ltd have been manufacturing semiconductor products for over 60 years; providing IGBT, Bipolar, Power Assembly and Electric Vehicle System products to customers across the world. As a business, we constantly strive to grow and develop as a leading, independent manufacturer of high power and high-reliability electronic components. 

It is an exciting time to be joining Dynex as we embark on a number exciting projects, which you can be part of; we are looking for a number of WBG Engineers covering a range of aspects of power GaN device design and packaging.

THE OPPORTUNITY

Keen to find a role that offers a challenge and an opportunity to develop future WBG chips and packaging for our growing customer base? The roles will include not limited to:

WBG Chip Engineer

• Project related activities & teams within the R&D Centre involving the use of TCAD software tools to design and develop the power GaN (Gallium Nitride) semiconductor chip and module products.
• Investigation of GaN or other WBG materials, new device concepts, and processes.
• Perform manual and automatic wafer level and package level testing to characterise GaN Power devices including laboratory bench characterisation.
• Understand the interactions between process, device design, and reliability of the device by performing detailed statistical data mining and analysis.
• Providing written reports, oral presentations and publication as appropriate.

WBG Packaging Engineer

• Undertakes project related activities within the R&D Centre with a particular focus on SiC and GaN-based wide-bandgap Power-Module Packaging: research; design, computer simulation; experimentation; testing and documentation. 
• Working on applying advanced technologies for high power density and high efficiency WBG power modules design & packaging, gate drives, modulation techniques, and high frequency magnetic components.
• Working on high speed SiC or GaN devices-based power modules and their challenges in protection, EMI/EMC, and parasitic control is expected.
• Lead major project work and have responsibility for delivering high quality work.
• Providing written and verbal engineering reports and presentations on work done as appropriate.

ABOUT YOU

As a team, we work really closely together, we are looking for a number of WBG device Engineers who have experience working with power GaN chips and modules within a research and development capacity. We will support and develop the team, therefore these roles would suit Engineers who are keen to take on a new challenge and project. To be considered for one of the roles you require:

WBG Chip Engineer

• A relevant MS. or Ph.D. degree in Electrical Engineering, Physics or Material Science
• Strong experienced with HEMT (High Electron Mobility Transistor), and power semiconductor devices physics and fabrication principles are essential.
• At least 3 years’ experience in GaN Power Device or wide bandgap device physics in a technology development environment (years attending Post Doc. experience will be considered).
• Experience with GaN semiconductors device manufacturing and process development is essential.
• Experience in finite element and mixed-mode TCAD simulations is essential.
• Characterization of the semiconductor device parameter analyser, such as Agilent B1500 series or others.
• Knowledge of chip tape-out flow and E-CAD tool.

WBG Packaging Engineer

• A PhD degree in a science or engineering subject or equivalent relevant industrial experience in semiconductor packaging engineering.
• Solid knowledge in SiC or GaN devices and related packaging technologies.
• Proficient in some of modelling tools such as: 3D mechanical, Ansys Maxwell, Simplorer, Q3D, PLECS, and LTSpice/PSpice.
• Experience of SolidEdge or other drawing software.
• Knowledge of gate drives, DC/AC, DC/DC, high frequency inductive and capacitive components, EMI/EMC, thermal and cooling are desirable.
• Experiences of multilayer high frequency and high-power PCB design are desirable.
• Experiences of SMD packages of both ICs and passive components.
• Knowledge of the challenges and requirements of power semiconductor device and module electrical, thermal test and characterization.
• Knowledge and experience in power semiconductor packaging, materials and fabrication process.
• Prototyping and experimental experience of medium to high power converters (650V-1200V, 150kW-200kW) is welcomed but not essential.

TO APPLY

If you are looking for a rewarding role within a Company that encourages progression and development, please look at our current vacancies and schemes – we would love to hear from you! Click ‘Apply’ to submit your CV.

CONTACT US

Should you have a question in relation to this job opportunity, please contact the HR team on recruitment@dynexsemi.com and one of the team will come back to you.

Please, no agencies.