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WBG Device Engineers (Packaging & Chip Engineers)

Hours of Work: 35.5 - Office Days: 8.30am – 5.00pm Monday to Thursday and 8.30am – 2.00pm on a Friday. This role also benefits from Flex Time and a hybrid of office / home working, after successful probationary.
Job Type: Permanent


Dynex Semiconductor Ltd have been manufacturing semiconductor products for over 60 years; providing IGBT, Bipolar, Power Assembly and Electric Vehicle System products to customers across the world. As a business, we constantly strive to grow and develop as a leading, independent manufacturer of high power and high-reliability electronic components. 

It is an exciting time to be joining Dynex as we embark on a number exciting projects, which you can be part of; we are looking for a number of WBG Engineers covering a range of aspects of power GaN device design and packaging.



Keen to find a role that offers a challenge and an opportunity to develop future WBG chips and packaging for our growing customer base? The roles will include not limited to:

WBG Chip Engineer

  • Project related activities & teams within the R&D Centre involving the use of TCAD software tools to design and develop the power GaN (Gallium Nitride) semiconductor chip and module products.
  • Investigation of GaN or other WBG materials, new device concepts, and processes.
  • Perform manual and automatic wafer level and package level testing to characterise GaN Power devices including laboratory bench characterisation.
  • Understand the interactions between process, device design, and reliability of the device by performing detailed statistical data mining and analysis.
  • Providing written reports, oral presentations and publication as appropriate.

WBG Packaging Engineer

  • Undertakes project related activities within the R&D Centre with a particular focus on SiC and GaN-based wide-bandgap Power-Module Packaging: research; design, computer simulation; experimentation; testing and documentation. 
  • Working on applying advanced technologies for high power density and high efficiency WBG power modules design & packaging, gate drives, modulation techniques, and high frequency magnetic components.
  • Working on high speed SiC or GaN devices-based power modules and their challenges in protection, EMI/EMC, and parasitic control is expected.
  • Lead major project work and have responsibility for delivering high quality work.
  • Providing written and verbal engineering reports and presentations on work done as appropriate.



As a team, we work really closely together, we are looking for a number of WBG device Engineers who have experience working with power GaN chips and modules within a research and development capacity. We will support and develop the team, therefore these roles would suit Engineers who are keen to take on a new challenge and project. To be considered for one of the roles you require:

WBG Chip Engineer

  • A relevant MS. or Ph.D. degree in Electrical Engineering, Physics or Material Science
  • Strong experienced with HEMT (High Electron Mobility Transistor), and power semiconductor devices physics and fabrication principles are essential.
  • At least 3 years’ experience in GaN Power Device or wide bandgap device physics in a technology development environment (years attending Post Doc. experience will be considered).
  • Experience with GaN semiconductors device manufacturing and process development is essential.
  • Experience in finite element and mixed-mode TCAD simulations is essential.
  • Characterization of the semiconductor device parameter analyser, such as Agilent B1500 series or others.
  • Knowledge of chip tape-out flow and E-CAD tool.

WBG Packaging Engineer

  • A PhD degree in a science or engineering subject or equivalent relevant industrial experience in semiconductor packaging engineering.
  • Solid knowledge in SiC or GaN devices and related packaging technologies.
  • Proficient in some of modelling tools such as: 3D mechanical, Ansys Maxwell, Simplorer, Q3D, PLECS, and LTSpice/PSpice.
  • Experience of SolidEdge or other drawing software.
  • Knowledge of gate drives, DC/AC, DC/DC, high frequency inductive and capacitive components, EMI/EMC, thermal and cooling are desirable.
  • Experiences of multilayer high frequency and high-power PCB design are desirable.
  • Experiences of SMD packages of both ICs and passive components.
  • Knowledge of the challenges and requirements of power semiconductor device and module electrical, thermal test and characterization.
  • Knowledge and experience in power semiconductor packaging, materials and fabrication process.
  • Prototyping and experimental experience of medium to high power converters (650V-1200V, 150kW-200kW) is welcomed but not essential.



If you are looking for a rewarding role within a Company that encourages progression and development, please look at our current vacancies and schemes – we would love to hear from you! Click ‘Apply’ to submit your CV.



Should you have a question in relation to this job opportunity, please contact the HR team on and one of the team will come back to you.

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