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Power Module Engineer (Packaging, Process & Test)

Hours of Work: 35.5 - Office Days: 8.30am – 5.00pm Monday to Thursday and 8.30am – 2.00pm on a Friday. This role also benefits from Flex Time and a hybrid of office / home working, after successful probationary.
Salary:
Job Type: Permanent

DYNEX SEMICONDUCTOR LTD

Dynex Semiconductor Ltd have been manufacturing semiconductor products for over 60 years; providing IGBT, Bipolar, Power Assembly and Electric Vehicle System products to customers across the world. As a business, we constantly strive to grow and develop as a leading, independent manufacturer of high power and high-reliability electronic components. 

It is an exciting time to be joining Dynex as we embark on a number exciting projects, which you can be part of. We are looking for a number of Power Semiconductor Module Engineers covering a range of aspects including packaging process, test and characterisation.

 

THE OPPORTUNITY

Keen to find a role that offers a challenge and an opportunity to develop and improve modules for our growing customer base? The roles will include not limited to:

Module Process Engineer

  • Focus on high Power IGBT and WBG Module advanced packaging technology development.
  • Carries out research and development of internationally recognised standard on engineering on power module packaging process technology and material.
  • Providing written and verbal engineering technical reports and presentations on work done as appropriate.
  • Publish research related papers/articles in international peer reviewed journals and conference proceedings.
  • Must demonstrate dedication and achievement in achieving continuous improvement across their key activities.

Module Test Engineer

  • Focus on IGBT and WBG power module routine electrical test and characterisation, as well as module product qualification test on high voltage and high current test up to 6.5kV and 5000A. 
  • Carries out research on new power module test and new test concept methodology development.
  • Leads the RDC test and characterisation activities, and have responsibility for planning and performance of project output.
  • Provides written engineering technical test reports and presentations on work done as appropriate.
  • Publishes research related papers/articles in international peer reviewed journals and conference proceedings.

 

ABOUT YOU

As a team, we work really closely together, we are looking for a number of Module Engineers who have experience working with packaging, process and test of IGBT modules within a research and development capacity. We will support and develop the team, therefore these roles would suit Engineers who are keen to take on a new challenge and project. To be considered for one of the roles you require:

Module Process Engineer

  • A Bachelors and/or Master’s degree in a science or engineering subject or equivalent relevant experience in semiconductor packaging engineering.
  • Experience in microelectronics or power semiconductor packaging technology; materials and process.
  • Comprehensive experiences of vacuum soldering, low temperature sintering, wire bonding, lead bonding, USW, planar packaging, 3D packaging, flip chip packaging etc.
  • Experience of IC and low power packaging is desirable.
  • Knowledge of the challenges and requirements of semiconductor packaging design, material and processing.
  • Good analytical and practical skills for laboratory & test-rigs based work.
  • Assist in new product development and product improvement including design, analysis, supplier selection and testing.

Module Test Engineer

  • A Bachelors and/or Master’s degree in science or engineering subjects or equivalent relevant experience in semiconductor packaging engineering.
  • Knowledge of the challenges and requirements of power semiconductor device and module electrical test and characterisation
  • Experience in high power, high voltage and high current semiconductor device test and characterization, including but not limited to static test, dynamic test, thermal impedance test, power cycling test, short-circuit test and so on.
  • Experience in high power wide bandgap device test is an advantage.
  • Ability to present data in a meaningful way that allows understanding by a diverse audience.
  • Good analytical and practical skills for laboratory & test-rigs based work.
  • Assist in new product development and product improvement in qualification
  • Understanding and practical experience in lifetime and reliability test requirements and standards for semiconductor power module products.

 

TO APPLY

If you’re looking for a rewarding role within a Company that encourages progression and development, please take a look at our current vacancies – we’d love to hear from you! Click ‘Apply’ to submit your CV .

 

CONTACT US

Should you have a question in relation to this job opportunity, please contact the HR team on recruitment@dynexsemi.com and one of the team will come back to you.

Please, no agencies.

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Should you have a question or if you wish to speculatively send your CV for an opportunity with us, please contact HR at: recruitment@dynexsemi.com.

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