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| Power Assemblies | Clamps | Heatsinks | Technical Enquiry Form |
| Double Side Cooled | Single Side Cooled | Cube |
To achieve optimum performance and to ensure safe operation, disc
semiconductor devices require application of the correct clamping force.
The correct clamping force for a device is given in the device datasheet.
The clamp outlines shown in this section are intended to give an overall
impression of size and shape, and they should not be scaled for more
detailed design purposes.
Full engineering drawings may be
obtained from Customer Services : Tele : +44 (0)1522 502901 / 502753 or
Email : power_solutions@dynexsemi.com
Clamp Part Numbers
 |  |
When determining the length of tie rods / bolts required, the following
can be used as an approximation:
(1.5x bolt diameter) + device
thickness + Dim X
Bolts can be supplied in increments of 5mm.
Single Side Cooled Clamp Outlines
 |  | |||||
| 31045A3-XXXX-XXX : 49mm centres | 31081A3-XXXX-XXX : 75mm centres (T, M771 and E disc/puk outlines) | |||||
| Load (kN) | Dim 'X' | Dim 'Y' | Load (kN) | Dim 'X' | Dim 'Y' | |
| 3.0 / 4.5 | 24 | 34 | 2.75 / 3.0 / 4.5 / 5.5 | 35 | 50.5 | |
| 8.0 / 9.0 | 27 | 39 | 8.0 | 37 | 52.5 | |
| 7.0 / 8.0 | 25 | 39 | ||||
 |  | |||||
| 31051A3-XXXX-XXX : 75mm centres (G, M779b disc/puk outline) | 30502A2-XXXX-XXX : 100mm centres | |||||
| Load (kN) | Dim 'X' | Dim 'Y' | Load (kN) | Dim 'X' | Dim 'Y' | |
| 7.0 / 8.0 / 9.0 | 37 | 50 | 9.0 / 12.0 | 70 | 87 | |
| 10.0 / 11.0 / 12.0 / 12.5 / 15.0 | 43 | 55 | 18.0 / 19.5 / 22.0 / 23.5 | 74 | 91 | |
| Copyright © 2008 Dynex Semiconductor Copyright © 1995-2008 I-Next Ltd |
We welcome your comments about this service, please send them to: power_solutions@dynexsemi.com |