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| Power Assemblies | Clamps | Heatsinks | Technical Enquiry Form |
| Double Side Cooled | Single Side Cooled | Cube |
To achieve optimum performance and to ensure safe operation, disc
semiconductor devices require application of the correct clamping force.
The correct clamping force for a device is given in the device datasheet.
The clamp outlines shown in this section are intended to give an overall
impression of size and shape, and they should not be scaled for more
detailed design purposes.
Full engineering drawings may be
obtained from Customer Services : Tele : +44 (0)1522 502901 / 502753 or
Email : power_solutions@dynexsemi.com
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We welcome your comments about this service, please send them to: power_solutions@dynexsemi.com |