DYNEX Semiconductor Ltd has the capability to design, develop and manufacture custom IGBT modules.
Applications for power electronics devices often involve harsh operating conditions or environments necessitating devices capable of meeting these requirements.
DYNEX semiconductor utilises our vast experience in the manufacture of power semiconductors to design and produce high reliability IGBT modules customised to meet the individual demands for end applications
DYNEX capabilities can encompass the following:-
Laser welded assemblies
Ultrasonic Welding processes
Copper Wire bonds
Various die technologies (Trench gate, SiC..)
Liquid cooled heatsinks
Customised busbar arrangements
Customised packaging (case materials)
Environmental sealed packages
Dynex has designed and manufactured modules that have helped our customers
Reduce system cost
Reduce total system size & weight
Improve thermal characteristics
Maximise system efficiency
Operate in severe environments
Research characteristics & performance
Using our in-house design team, Dynex continues to develop own processes and designs to utilise the latest techniques to improve cooling, current output, lifetime and reliability.
Through initial concept to full production, Dynex will support your requirements to provide enhanced, reliable device outlines to meet your stringent demands.
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